Influence of decomposition of oversatured liquid solutions on the structure and microhardness of quickly curing alloys of the Pb–Sn system

The results of studies of the structure and microhardness of foil alloys of the lead–tin system obtained by high-speed cooling from the liquid phase are presented. The foil sample had the following dimensions: length – up to 10 cm, width – up to 1 cm, and thickness – 30–80 microns. Melt cooling rate was not less than 105 K/s. A rapidly cooled foil is chara cterized by a dispersed structure. The size of the discharge of tin and lead does not exceed 5 μm. The specific surface of the interfacial boundaries achieve 1.7 μm–1. Due to supercooling, a microcrystalline structure forms in the foil. The average lengths of chords of random secants on lead and tin grain sections in the Pb–73 at.% Sn alloy foil are 0.8 and 1.8 μm respectively. The texture of (111) lead and (100) tin is formed in the foil of alloys of the lead – tin system under certain conditions. The formation of the structure of lead alloys containing from 20 to 95 at.% tin is due to the occurrence of spinodal decomposition of a supersaturated liquid solution, and, in other alloys, due to decay by the mechanism of formation and growth of nuclei of crystalline phases. The stratification of the liquid solution leads to the formation of areas enriched in lead and tin, which contribute to the formation of crystallization centers that are equally distributed in the volume of the foil. The microhardness of the foil alloys, whose compositions are close to eutectic, is less than the microhardness of massive alloys of the same composition, which is associated with the softening effect of grain boundaries and interphase boundaries. Exposure of these alloys at room temperature causes an increase in microhardness due to a decrease in slippage at the boundaries. The decomposition of supersaturated solid solutions of Pb–5 at.% Sn and Sn–1 at.% Pb alloys leads to a decrease in microhardness due to the weakening of the effect of the solid solution hardening mechanism. The results of the study can be used to create fusible solders, bearing alloys, alloys for cable sheaths with improved physicochemical properties.

high-speed solidification, lead, tin, microcrystalline structure, fine-dispersed structure, texture, microhardness, hardening mechanisms

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